Presentation
| Product type | Fludor paste |
Sale package
| Pack | Blister |
| Content | Fludor Paste |
| Product status | New |
Fludor Termopasty paste
The paste is designed for the soldering of SMD components in production processes that do not include the washing phase.
It is based on a "no clean" flux type that does not require cleaning and its residues do not cause corrosion centers.
The product cooperates with all lead-free alloys, exhibits good adhesion and wetting capability of the soldered surface.
It does not lose its physical and chemical properties even after being left for 20 hours on the PCB.
This time depends on room conditions: humidity and temperature.
